Integrated Electronic CADCSiEDA

WinPCB
PRINTED CIRCUIT BOARD DESIGN TOOL

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[Parts] Automatic generation of symbol shapes

Package builder

Easily create symbol shapes for DIP, SOP, QEP, BGA, and PLCC by simply entering numerical values, eliminating the need for complicated symbol creation.

[Wirings] A variety of wiring functions.

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Shape processing box

"Minimize the number of clicks" and "simplify complex processes".
Based on feedback from designers, we have incorporated shape processing box functionality to support these requests.
By simply clicking on various icons, users can execute a wide range of functions, resulting in a further reduction in design time.

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Wiring alignment pitch adjustment function

First click: Select the wire you want to shield.
Second click: Select the [Wire Shield] button.

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Copper pour feature

First click: Select the wire you want to create a copper pour for.
Second click: Click the "copper pour" button.
Third click: You can now freely modify the copper pour.

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Wiring Alignment Pitch Function

First click: Select the wire to be aligned.
Second click: Select the [Align Pitch] button and enter the desired pitch to be changed.

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Parallel wiring function

First click: Select the pad where you want to create parallel wiring.
Second click: Click the [Parallel wiring button] and enter the desired pitch.
* You can end parallel wiring with vias (diagonal, straight, downward, upward) while in the process.

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Object snap (wire pulling-in) function

Even if the wiring and pad grids are misaligned, the wiring can be snapped to the pad.

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Wiring pitch function

First click: Select "[T-branch wiring]" during wiring.
Second click: Enter the starting and ending line widths.

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Offset function

First click: Select the wiring to be continuously copied.
Second click: Select the [Offset wiring] and enter the pitch and number of copies to be made.

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Wire Bundle

First click: Select [Bundled wiring] .
Second click: Enter the number of wires and pitch for the wiring
* You can choose between arc mode, c-cut, and straight.

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Build-up wiring

Support for various designs with build-up wiring such as motherboards.

Various Functions

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Copper pour feature

First click: Select the pad you want to convert to a clinch pad.
Second click: Select [Customize Pad], and enter the values.
* Supports clinch, rounded corner, breadboard, and tear drop shapes.

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Custom Pad Creation Function

First click: Select the circular or square copper plane for the pad you want to create a land cut for.
Second click: Choose the [Copper Feature] option and perform a copper cut to create the desired shape.
Third click: Change the copper feature to a pad with the desired land cut shape.

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Automatic copper pour and floating copper removal function

First click: Select the copper feature where you want to remove automatic or floating copper pour.
Second click: Select the option for [automatic copper pour removal] or [floating copper removal]

Drawing creation function

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Drawing creation function

You can select the area you want to zoom in on and place a magnified drawing.

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Drawing creation function

Net density information, Component density information, Component heat generation information, Wiring density information, Component height information, Component current value information, VIA density information, Component weight information.

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Restoration from Gerber data

Gerber in

You can load not only data output from WinPCB but also Gerber data output from other companies.

* After importing Gerber into WinGerber, convert the data to WGG file and input it into WinPCB.

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Diverse verification functions considering PCB manufacturing

PollEx
Printed Circuit Board Design Verification Tool

Equipped with DFM/DFE verification functions. Includes DRC function and electrical characteristics check taking into account the manufacturing of printed circuit boards.

Integration with PollEx starts from CSiEDA Ver.6.

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EMI/EMC measures (noise reduction measures)

DMITASNX

EMI Suppression Design Support Tool

Signal Adviser

Signal Verification by Circuit Design
Automatic Advice System

CSiEDA is an integrated electronic CAD system that supports the entire process of electronic circuit design. It is capable of total design from circuit design to PCB design/electromechanical design. We provide various simulations for high-quality PCB design in addition to shortening the design process. WinPCB offers high functionality for digital/analog design.

With the recent trend of miniaturization, high density, and high-layer PCBs, CSiEDA enables designers to achieve their intended designs with trimming, shape division, automatic placement, automatic shielding, and build-up board support. In addition, the split design function allows designers to divide design tasks and shorten delivery times. When transitioning from other CAD systems, existing design data can be utilized by converting ASC/Gerber data to WinPCB.

OVERVIEW

  • Menu customization

  • Icon customization

  • Macro function using Java and VB script

  • Backup function (file number and time settings available)

  • Zoom in/zoom out/fit to screen/full screen display

  • Zoom in/zoom out using scroll button

  • SQL database support

  • Component/drawing converter for Ver.4.0

  • Design in millimeters/mils

  • Print preview/offset function

  • Arbitrary movement of origin

  • Virtual origin

  • Undo/Redo (MAX=20)

  • DXF input/output support

  • Support for split design

  • Filter function (selectable by attribute values such as line width)

  • Move and arrange components with Enter key

  • Operation cancel and selection mode with ESC key

  • Expandable to 1,024 layers

  • Layer lock function

  • Conversation layer display

  • Pair layer display

  • Customizable display

  • Direct 3DView display

  • Various CAD I/F (data, drawing, netlist)

  • Trace function

  • Fill/outline display

  • OLE

  • Menu usage/unused, display/hidden settings available

  • Inspector function (change item properties (database))

CREATING COMPONENTS

  • Extension of the pad stack function (up to 1,024 layers)

  • Users can register their created pads in the pad stack

  • Support for inner layer thermal (45/90 degrees), clearance, and land creation

  • Automatic/manual updating of pad numbers

  • Functionality for creating pads using JavaScript

  • Component creation wizard

  • Offset copy/move function

  • Support for restricted wiring areas

  • Support for restricted via areas

  • Support for copper forbidden area

  • Support for component height areas

  • Support for copy/paste functionality

  • Pad rotation angle specification

  • Drawing rotation angle specification

  • Trimming

  • Shape division

  • Setting of reference name/attribute size

  • Double-sided reference name placement

  • Changing the origin position of the text size

  • Setting of text pitch

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PCB CREATION

  • Moving components at the center or at pin 1

  • Support for moving items using the keyboard arrow keys

  • Alternate specification support for components on the component side/solder side

  • Support for moving/deleting component pads

  • Add Pad Functionality to Component

  • Add Pads

  • Add Test Points

  • Attribute changes (individual/batch)

  • Cutting component silk screen

  • Component class settings

  • Component mounting type settings

  • Component changes (individual/batch)

  • Offset placement

  • Matrix placement

  • Radial placement

  • Component locking

  • Component list

  • Editing component silk screen

PLACEMENT

  • Improvement of wiring editing

  • Wiring loop check

  • Wiring movement

  • Wiring offset movement

  • Wiring line exchange

  • Taper wiring function

  • Parallel wiring function

  • Wiring pitch width specification function

  • Wiring highlighting display

  • Angular wiring function

  • Wiring copy function

  • Wiring offset copy function

  • Trapezoidal wiring function

  • Net name ON/OFF

  • Pad number display ON/OFF

  • Wiring length setting

  • Tear drop wiring

  • Automatic wiring

  • Semi-automatic wiring

  • IVH via

  • Build-up board

  • Pad-on-via

  • 3D realistic display design

  • Net addition

  • Net swap

  • Net color coding

  • Division of the same net

  • Editing net name

  • Net deletion (individual/batch)

  • Net display ON/OFF

  • Support for start angle specification of wiring corner (e.g., 45-degree corner starting position)

  • Support for 45/90-degree thermal wiring

  • Direct copper conversion function for wiring

BOARD OUTLINE

  • PCB outline creation function from DXF data

  • Line offset function

  • Rounding corners function for PCB

  • Auxiliary line function

  • Offset copy/move function

  • Trimming function

  • Command-line input (absolute/relative)

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COPPER

  • Offset function for copper (inner/outer)

  • Function to combine copper shapes

  • Copper extraction function

  • Function to specify cutouts in copper shapes

  • Trimming of copper shapes

  • Editing of copper shapes

  • Transformation of shapes into copper (DXF/Gerber data)

  • Normal copper shapes

  • Copper cutout shapes

  • Auto copper shapes

  • Function to automatically remove floating copper shapes

  • PowerPlane

  • Internal layer division

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SHAPE

  • Extension of trimming function

  • Enhancement of drawing functions (direct editing of circles and arcs)

  • Support for angle specification of shapes and components

  • Option to create auxiliary lines on a per-layer basis

  • Option to delete auxiliary lines as needed

  • Batch trimming

  • Alignment function

  • Evenly spaced arrays

  • Object snap

  • Internal layer division

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DRC

  • Net check function

  • DRC inner layer check

  • Prohibited area for component placement

  • Prohibited area for vias

  • Prohibited area for wiring

  • Prohibited area for copper planes

  • Prohibited area for component height

  • Online DRC

  • DRC design log

  • Shortest distance measurement

  • Batch measurement of shortest distance

  • Wiring angle check

  • Measurement tool

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CAM

  • 274D/274X Gerber compatibility

  • NC drill output

  • NC coordinate/tool table separation

  • Excellon output

  • NC hole instruction diagram data

  • Mounting component coordinate output

  • Surface mounting (compatible with mixed surfaces)

  • Gerber-in

  • Board inversion

  • Board rotation (45, 90, 180 degrees)

  • Gerber data output (individual, batch)

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MATERIALS

  • Drawing enlargement function

  • Wiring database report

  • Via list report

  • Wiring length report

  • Pad stack report

  • Temperature distribution map

  • Component placement information report

  • Height component diagram

  • Site placement distribution diagram

  • Density distribution map

  • Netlist output

  • Assembly drawing creation

  • Wiring density distribution diagram

  • Display of pattern outline for inspection

  • 3D mounting diagram

CONTACT US

SPECIAL USER SITE ━
Sing In
If you have a maintenance contract for our products, you can access our members-only site.
  • +81-6-6377-2451
    9:00 - 18:00 (JST) on weekdays.
  • INQUIRY